Current Status of High-n Immersion Lithography Development

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A feasibility study is being conducted on the subject of extending the resolution capability of immersion lithography exposure systems with high-n fluids to 35nm and below. Fluids, for evaluation, are available from chemical vendor companies such as DuPont, Mitsui, and JSR. The new fluids have a refractive index of approximately 1.65. This makes it possible to design optics with a numerical aperture of 1.55, which is a 17% extension on the highest numerical aperture possible with water-based immersion lithography.<br>The feasibility study has examined all the key factors associated with the possible introduction of high index immersion lithography. These aspects include: fluid handling challenges; UV exposure impact on fluid performance; fluid recycling to mitigate the effects of UV exposure; fluid interaction with resist; and the mechanisms involved in the generation of stains and imaging defects. Imaging tests using interference printing to define profiles in resist at 29nm L/S are reported.<br>To complete the analysis, the progress in enabling developments such as final lens element optical materials is reported, and the potential position for the technology in the lithography roadmap is discussed.

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