Development of measurement device for polishing pad surface asperity on the upper platen of a double-sided polisher and its application for evaluation of polishing characteristics

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  • 両面同時研磨における上定盤研磨パッド表面性状測定装置の開発と研磨特性の評価
  • リョウメン ドウジ ケンマ ニ オケル ジョウ ジョウバン ケンマ パッド ヒョウメン セイジョウ ソクテイ ソウチ ノ カイハツ ト ケンマ トクセイ ノ ヒョウカ

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Abstract

This paper describes the development of a device for measuring the removal rate and polishing pad surface asperity on both upper and lower platens in double-sided polishing. A previous measurement device developed by the author's research group cannot evaluate the polishing pad on the upper platen because of the deadweight system, and can be applied to the lower platen only. Therefore, we developed a novel measurement device for the upper platen using the restoring force exerted by the springs. In this study, the conditioning characteristics and removal rate were examined from the viewpoint of the polishing pad surface asperities and profiles in double-sided polishing. The results indicated that the spacing of contact points and the dispersion level of the contact regions markedly affect the removal rate. Furthermore, the effect of the polishing pad on the upper platen on the removal rate is higher than that on the lower platen.

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