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- SUGIMOTO Masaharu
- Kanto Gakuin University Surface Engineering Research Institute
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- MATSUBARA Toshiaki
- Department of Applied Material and Life Science, College of Engineering, Kanto Gakuin University
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- HONMA Hideo
- Kanto Gakuin University Surface Engineering Research Institute Department of Applied Material and Life Science, College of Engineering, Kanto Gakuin University
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- KOUZAI Hiroaki
- Kanto Gakuin University Surface Engineering Research Institute Department of Applied Material and Life Science, College of Engineering, Kanto Gakuin University
書誌事項
- タイトル別名
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- Effects of α, ω-Diphenylazophenoxy Polyethylene Glycol on Copper Deposition
- Effects of a o diphenylazophenoxy polyethylene gIycol on copper deposition
この論文をさがす
抄録
This paper describes the effects of polyethylene glycol (PEG) derivatives on copper electroplating. α, ω-Diphenylazophenoxy polyethylene glycol (PEG-Az) of the novel PEG derivative provides interesting results, suppressing copper deposition during copper electroplating. We found that PEG-Az suppresses copper deposition without the chlorideion (Cl-ion). To determine the reason for this action, we carried out linear sweep voltammetry (LSV), glow discharge optical emission spectroscopy (GDOES), and electrochemical quartz crystal microbalance (EQCM) measurements for the plating bath containing PEG-Az. PEG-Az was found to be a stronger suppression effect than the PEG even without the Cl-ion.
収録刊行物
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- マテリアルライフ学会誌
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マテリアルライフ学会誌 19 (3), 132-135, 2007
マテリアルライフ学会
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詳細情報 詳細情報について
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- CRID
- 1390001204339284608
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- NII論文ID
- 10019740863
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- NII書誌ID
- AA11583427
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- COI
- 1:CAS:528:DC%2BD2sXhtFOgsbbI
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- ISSN
- 21857016
- 13460633
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- NDL書誌ID
- 8914921
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可