Electromigration Lifetime Test in Damascene Copper Interconnects using Sudden Death Test Structure and OBIRCH

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  • YOKOGAWA Shinji
    NECエレクトロニクス株式会社生産事業本部製品技術事業部信頼性品質管理グループ

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  • サドンデスTEGとOBIRCHを用いたダマシンCu配線のエレクトロマイグレーション評価
  • サドンデス TEG ト OBIRCH オ モチイタ ダマシン Cu ハイセン ノ エレクトロマイグレーション ヒョウカ

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The bimodal electromigration lifetime of damascene Cu interconnects was investigated by using a new sudden death test structure. Parameter estimation by the test structure is highly superior to that of non-sudden death approach even with a small sample size. In addition, the test structure shortens the reliability test period of electromigration. The test structure was amenable to failure analysis tools such as OBIRCH. Early failure was due to the void growth in the bottom of Via. Intrinsic failure was due to the void growth under Via.

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