Development of Wafer Level Chip Size Packaging Process and its Application to the CMOS Image Sensor Module for Medical Device
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- Fujimori Noriyuki
- JISSO Technology Department, Olympus Corporation Interdisciplinary Graduate School of Science and Technology, Shinshu University
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- Igarashi Takatoshi
- JISSO Technology Department, Olympus Corporation
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- Shimohata Takahiro
- JISSO Technology Department, Olympus Corporation
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- Suyama Takuro
- JISSO Technology Department, Olympus Corporation
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- Yoshida Kazuhiro
- JISSO Technology Department, Olympus Corporation
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- Nakagawa Yusuke
- JISSO Technology Department, Olympus Corporation
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- Nakamura Tsutomu
- COI STREAM Research Promotion Institution, Tohoku University
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- Sato Toshiro
- Interdisciplinary Graduate School of Science and Technology, Shinshu University
Bibliographic Information
- Other Title
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- 医療用CMOS撮像モジュールへの応用を目指した撮像素子WL-CSPプロセスの開発
- イリョウヨウ CMOS サツゾウ モジュール エ ノ オウヨウ オ メザシタ サツゾウ ソシ WL-CSP プロセス ノ カイハツ
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Abstract
<p>A new packaging technique has been realized and applied to the imaging module for medical endoscope. In order to realize minimal invasiveness for in-vivo medical device applications, the WL-CSP (Wafer Level-Chip Size Package) is one of the most attractive technology. However, in the field of medical device packaging, the packaging needs are diversified and required number of each package does not meet the huge sized wafer processing. In this new technique, the CMOS image sensor wafer is diced at first, and then individual image sensor chips are rearranged on another smaller handling wafer. As a result, suitable size of the handling wafer can be selected for the production volume, and lower production cost and shorter production lead time can be achieved. The packaged image sensor with new packaging technique showed no significant degration of charactristic of image sensor.</p>
Journal
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- IEEJ Transactions on Sensors and Micromachines
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IEEJ Transactions on Sensors and Micromachines 137 (2), 48-58, 2017
The Institute of Electrical Engineers of Japan
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Keywords
Details 詳細情報について
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- CRID
- 1390001204460051840
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- NII Article ID
- 130005306513
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- NII Book ID
- AN1052634X
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- ISSN
- 13475525
- 13418939
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- NDL BIB ID
- 027967107
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed