Compact Triangulation Sensor Realized by Bending Si Wafer with Optical Elements at Metal Hinges
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- Sasaki Minoru
- Dept. of Advanced Science and Technology, Toyota Technological Institute
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- Endou Satoshi
- Dept. of Nanomechanics Eng., Tohoku University
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- Hane Kazuhiro
- Dept. of Nanomechanics Eng., Tohoku University
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A triangulation distance sensor is constructed bending the wafer with metal hinges. On the Si wafer, elements are pre-aligned at the planer condition using the photolithography. The position sensitive detector (PSD), mirror, and alignment pit for a ball lens are prepared. 3-sensor array is integrated in 20×17×10 mm3 size. Compared with our previous study using polymer, the metal hinge stabilizes the long-term performance and the process. Optical elements including LD chip are all included on the wafer. The demonstrated measurement range is 18-40 mm.
収録刊行物
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- 電気学会論文誌Ｅ（センサ・マイクロマシン部門誌）
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電気学会論文誌Ｅ（センサ・マイクロマシン部門誌） 128 (6), 271-276, 2008
一般社団法人 電気学会
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詳細情報 詳細情報について
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- CRID
- 1390001204461792384
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- NII論文ID
- 10021135443
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- NII書誌ID
- AN1052634X
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- ISSN
- 13475525
- 13418939
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- NDL書誌ID
- 9532719
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
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