MEMS材料としてのNi-W合金メツキ膜

DOI Web Site Web Site 被引用文献2件 参考文献12件

書誌事項

タイトル別名
  • Study of Ni-W alloy as a MEMS Material
  • MEMS ザイリョウ ト シテ ノ Ni-W ゴウキン メッキ マク

この論文をさがす

抄録

In micro mechanical devices with high aspect ratios, LIGA or LIGA-like processes are commonly used. In such a process, the material of the device structure is electroplated with nickel or copper because of ease of deposition. In this paper, an alternative material, electroplated nickel-tungsten alloy is examined as an MEMS material. Preliminary results of measurements of the mechanical, chemical and magnetoelectrical properties are shown and discussed. It is found that the Ni-W alloy film shows excellent characteristics such as low internal friction, high chemical resistance.

収録刊行物

被引用文献 (2)*注記

もっと見る

参考文献 (12)*注記

もっと見る

キーワード

詳細情報 詳細情報について

問題の指摘

ページトップへ