Investigation on Wire delamination Mechanism Made on Flexible Wiring Substrates with Electroless Nickel Plating Seed Layer

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  • Kohtoku Makoto
    JCU Corporation R&D Center Graduate School, Kanto Gakuin University Materials & Surface Engineering Research Institute, Kanto Gakuin University
  • Nakamaru Yaichiro
    JCU Corporation R&D Center
  • Honma Hideo
    Materials & Surface Engineering Research Institute, Kanto Gakuin University
  • Takai Osamu
    Materials & Surface Engineering Research Institute, Kanto Gakuin University

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  • 無電解めっきシード層形成フレキシブル回路基板の配線剥離メカニズムの検討
  • ムデンカイメッキ シードソウ ケイセイ フレキシブル カイロ キバン ノ ハイセン ハクリ メカニズム ノ ケントウ

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We previously reported on a flexible copper-clad laminate having high peel strength that was fabricated using electroless-plating of a Ni-seed layer on polyimide. However, the wiring delaminated from the polyimide surface during the circuit formation process. Alkali from the resist stripping process was observed to penetrate the Ni plating and polyimide interface, after which the Ni plating was corroded by the acidic solution causing the wiring to delaminate. The surface modified layer thickness on the polyimide formed for the electroless Ni plating was related to the penetration under the wiring by the alkali. Wire delamination could then be prevented by thinning the surface modified layer to the nanometer scale.

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