The Relations between Adhesion and Internal Stress of Electroless Pure Ni Film on Smooth Alumina Substrate

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  • Ito Kiyoshi
    Department of Materials Science and Chemistry, Graduate School of Engineering, University of Hyogo
  • Fukumuro Naoki
    Department of Materials Science and Chemistry, Graduate School of Engineering, University of Hyogo
  • Yae Shinji
    Department of Materials Science and Chemistry, Graduate School of Engineering, University of Hyogo
  • Matsuda Hitoshi
    Department of Materials Science and Chemistry, Graduate School of Engineering, University of Hyogo

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Other Title
  • 平滑アルミナ基板と無電解純Ｎｉめっき膜の密着性と内部応力との関係
  • ヘイカツ アルミナ キバン ト ムデンカイ ジュンNiメッキ マク ノ ミッチャクセイ ト ナイブ オウリョク ト ノ カンケイ

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We investigated the relationship between adhesion and internal stress to improve the adhesion of electroless pure Ni plating on a smooth alumina substrate, focusing on the energy balance in the interface between the substrate and the film. We measured both parts for unified energy (J/m2) and found the ideal adhesion energy. In the measured results, peel energy Gp is dependent on film thickness, and thicker film reduced the Gp of the Ni plating. Since the thickness of columnar crystal pure Ni plating film is more than 0.2 μm, columnar crystal pure Ni plating is highly adhesive on smooth alumina substrates. Interfacial adhesion energy Gad which is the ideal adhesion energy is not simply the sum of peel energy Gp (adhesion) and internal strain energy Gin (internal stress); we also must consider bending energy Gbend, elastic energy Gel, and fracture energy Gf. The gains achieved reflect the high adhesion property of columnar crystal pure Ni plating compared to nano crystalline pure Ni plating. In this study we successfully controlled both the appearance of the void for the interface between the substrate and the film to minimize internal strain energy Gin, and the strength around the interface between the substrate and the film to minimize elastic energy Gel and fracture energy Gf.

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