Cu-Coated Zn/Al Clad Solder for High Temperature Die Attachment

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  • Yamaguchi Takuto
    Packaging Technology Solutions Research Dept., Manufacturing Technology Research Center, Yokohama Research Laboratory, Hitachi, Ltd.
  • Ikeda Osamu
    Packaging Technology Solutions Research Dept., Manufacturing Technology Research Center, Yokohama Research Laboratory, Hitachi, Ltd.
  • Hata Shohei
    Packaging Technology Solutions Research Dept., Manufacturing Technology Research Center, Yokohama Research Laboratory, Hitachi, Ltd.
  • Oda Yuichi
    Electric Wire Division, Cable Materials Company, Hitachi Metals, Ltd.
  • Kuroki Kazuma
    Electric Wire Division, Cable Materials Company, Hitachi Metals, Ltd.

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Other Title
  • 高温ダイアタッチ向けCu被覆Zn/Alクラッド接合材
  • コウオン ダイアタッチ ムケ Cu ヒフク Zn/Al クラッド セツゴウザイ

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Description

Zn/Al/Zn and Zn/Al/Cu clad materials were developed for high-temperature die attachment. The clad structure is used in an attempt to improve the wettability of Zn-Al solder by preventing oxidation of the Zn and Al. The materials were produced by clad-rolling Zn, Al and Cu strips, which act as solder following eutectic melting at temperatures above 382°C. The wettability, bondability and reliability of the clad materials were evaluated. The Zn/Al/Cu clad materials could be used in an atmospheric oxygen concentration of 100 ppm. The thermal cycle life of chip-to-substrate joints formed using the Zn/Al/Cu clad materials was four times longer than that formed using Pb-Sn-Ag solder.

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