書誌事項
- タイトル別名
-
- Extraction of Solder Constituent from CSP Boards by Means of X-ray Energy Subtraction Method.
- Xセン エネルギサブトラクション ニ ヨル CSP ジッソウ キバン ノ ハンダ セイブン チュウシュツ
この論文をさがす
説明
With the high requirement of high-density packaging, CSP have been spread widely. To inspect the solder joint in CSP, an X-ray image has been used. However, an X-ray image contains not only solder joint but also capper leads. Therefore, it is very difficult to analyze the solder with robustness. In this paper, we propose a new method for extracting the solder constituent by means of Energy Subtraction. In the experience, we compared the performance of thick measurement between regular X-ray Image and Subtraction image. The result shows the advantageous performance of Subtraction method over regular one.
収録刊行物
-
- エレクトロニクス実装学会誌
-
エレクトロニクス実装学会誌 4 (1), 68-71, 2001
一般社団法人エレクトロニクス実装学会
- Tweet
キーワード
詳細情報 詳細情報について
-
- CRID
- 1390001204560433920
-
- NII論文ID
- 110001716433
- 130004062866
-
- NII書誌ID
- AA11231565
-
- ISSN
- 1884121X
- 13439677
- http://id.crossref.org/issn/13439677
-
- NDL書誌ID
- 5630898
-
- 本文言語コード
- ja
-
- データソース種別
-
- JaLC
- NDLサーチ
- Crossref
- CiNii Articles
- OpenAIRE
-
- 抄録ライセンスフラグ
- 使用不可
