Precise Estimation of Propagation Constants of a Microstrip Line Based on Material Constants Measured for Copper-Clad Laminate Substrate

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  • 銅張り誘電体積層基板に関する材料定数の測定結果を用いたマイクロストリップ線路の伝搬定数の高精度評価
  • ドウバリ ユウデン タイセキソウ キバン ニ カンスル ザイリョウ テイスウ ノ ソクテイ ケッカ オ モチイタ マイクロストリップ センロ ノ デンパン テイスウ ノ コウセイド ヒョウカ

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The authors have precisely measured the frequency dependences of the complex relative permittivity in the normal and tangential directions, as well as the surface and interface conductivities for a copper-clad laminate dielectric substrate (AR-1000) in the frequency range 4–20 GHz. In this paper, based on these measured values, we calculate the frequency dependences of the attenuation constant α and the effective relative permittivity εeff for a 50-ohm microstrip line (MSL) using a 3-dimensional electromagnetic simulator (HFSS). The high precision of this estimate is verified from microwave measurements for a 50-ohm MSL fabricated on the AR-1000 substrate by an etching technique. Furthermore, an evaluation technique is proposed to estimate the dielectric, conductor, and radiation losses of the MSL separately and precisely using the HFSS. Thus, the influences of the unisotropic loss tangent of the substrate and rugged surface of a copper foil on α can be distinguished numerically using this technique. Finally, for a 50-ohm MSL with gold plating, the influence on α is estimated from the measured value of the conductivity of the gold plating layer.

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