High Adhesion Plating Process for ABS Resin using Ultrafine Bubble with Low Ozonated Water
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- Umeda Yasushi
- Kanto Gakuin University Research advancement and management organization Kanto Gakuin University Materials and Surface Engineering Research Institute
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- Nomura Taro
- Kanto Gakuin University Materials and Surface Engineering Research Institute Department of Industrial Chemistry, College of Engineering, Kanto Gakuin University
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- Nakagawa Haruyo
- Kanto Gakuin University Materials and Surface Engineering Research Institute Ebina Denka Kogyo Co.,Ltd.
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- Nakabayashi Yuki
- Kanto Gakuin University Materials and Surface Engineering Research Institute Department of Industrial Chemistry, College of Engineering, Kanto Gakuin University
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- Tashiro Katsuhiko
- Kanto Gakuin University Research advancement and management organization Kanto Gakuin University Materials and Surface Engineering Research Institute
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- Honma Hideo
- Kanto Gakuin University Materials and Surface Engineering Research Institute
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- Takai Osamu
- Kanto Gakuin University Materials and Surface Engineering Research Institute Department of Industrial Chemistry, College of Engineering, Kanto Gakuin University
Bibliographic Information
- Other Title
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- ウルトラファインバブルと低濃度オゾン水を使用したABS樹脂の高密着めっき法
- ウルトラファインバブル ト テイノウド オゾンスイ オ シヨウ シタ ABS ジュシ ノ コウミッチャクメッキ ホウ
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Description
A high-adhesion plating process for ABS resin was studied using a low concentration of ozone instead of using harmful hexavalent chromium. ABS resin can be modified by ultrafine, ozone-containing bubbles dispersed in water (<2 ppm). A high adhesion strength of approximately 1 kN/m was obtained when treated for 30 min. In contrast to the conventional etching processes containing hexavalent chromium, it is not necessary to apply a problematical wastewater treatment.<br>Accordingly, this treatment could be used as a new sustainable technology in the near future.
Journal
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- Journal of The Japan Institute of Electronics Packaging
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Journal of The Japan Institute of Electronics Packaging 19 (7), 492-500, 2016
The Japan Institute of Electronics Packaging
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Keywords
Details 詳細情報について
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- CRID
- 1390001204561002368
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- NII Article ID
- 130005398340
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- NII Book ID
- AA11231565
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- ISSN
- 1884121X
- 13439677
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- NDL BIB ID
- 027746245
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- Text Lang
- ja
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- Article Type
- journal article
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- Data Source
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- JaLC
- NDL Search
- Crossref
- CiNii Articles
- KAKEN
- OpenAIRE
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- Abstract License Flag
- Disallowed