Solder Shape Prediction and Residual Stress Evaluation of BGA Solder Joint.

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  • SAKAI Hidehisa
    Graduate School, Yokohama National University
  • YU Qiang
    Department of Mechanical Engineering, Yokohama National University
  • SHIRATORI Masaki
    Department of Mechanical Engineering, Yokohama National University
  • KANEKO Masahide
    Graduate School, Yokohama National University
  • FUKUDA Takashi
    Manufacturing System Engineering Group, Packaging Technology Division, Fujitsu Limited
  • MOTEGI Masanori
    Manufacturing System Engineering Group, Packaging Technology Division, Fujitsu Limited

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Other Title
  • ＢＧＡはんだ接合部の形状予測と残留応力評価
  • BGA ハンダ セツゴウブ ノ ケイジョウ ヨソク ト ザンリュウ オウリョク ヒョウカ

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In this paper, prediction methods of solder joint shape, such as solder joint height and contact angle, for BGA package, which is effective on high density packaging, are studied. Various calculation methods to predict the solder joint shape are studied, and results of the calculation are compared to experimental results to confirm the validity of each calculation methods. Approximate polynomial of solder joint shape, such as solder joint height and contact angle are induced by combining numerical differential method and response surface method using orthogonal table. Next, FEM calculation of board warpage are analyzed to evaluate residual stress in solder solidification process.

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