書誌事項
- タイトル別名
-
- Development of Emulsionized Developer of Solder Resists for Printed Wiring Boards.
この論文をさがす
説明
We have developed a novel developer of solder resists which are used for partly-additive printed wiring boards. We have discovered that emulsionized mixture of water-insoluble organic solvent in water can be used as a novel developer which has no ozone depletion potential. The developing characteristics, being comparable to that of trichloroethane, of this emulsionized developer are mainly attributed to the interfacial simultaneous action of water and the solvent. We have established a recycling process which consists of the salting-out techniques to efficiently recover the solvent from the waste. There are following merits of this developer; (1) lowered cost than trichloroethane, (2) suppressed toxicity, (3) no ozone depletion potential, and (4) lowered inflammability. Moreover, this developer can be used for the present resists without any change on the usual process and facilities in fabrication of printed wiring boards.
収録刊行物
-
- 回路実装学会誌
-
回路実装学会誌 11 (4), 257-261, 1996
一般社団法人 エレクトロニクス実装学会
- Tweet
キーワード
詳細情報 詳細情報について
-
- CRID
- 1390001204665852416
-
- NII論文ID
- 130004165360
-
- ISSN
- 18841201
- 13410571
-
- 本文言語コード
- ja
-
- データソース種別
-
- JaLC
- Crossref
- CiNii Articles
-
- 抄録ライセンスフラグ
- 使用不可