沸騰冷却を用いたコンピュータチップ用冷却器
書誌事項
- タイトル別名
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- Cooling Unit for Computer Chip by using Boiling Heat Transfer
抄録
In recent years, the heating value of CPU has been increasing rapidly in proportion to the improvement of computer performance. Therefore computer industry is requiring the new cooling unit having high cooling performance for CPU adaptable to high heating value and high heat flux. In the past the cooling unit for CPU is used with air-cooling aluminum fin, but it can not be adaptable to high heating value. We have developed a new compact boiling refrigerant type cooling unit for CPU having high cooling performance in comparing with air-cooling aluminum fin. This paper described the cooling performance and pressure drop characteristics of the boiling refrigerant type cooling unit for CPU. The characteristics were clarified by testing the cooling unit under various test conditions, which were different Reynolds number, various sizes of cooling unit and various inclination angles. Furthermore the equations to predict cooling performance and pressure drop which are necessary on design of the cooling unit were proposed.
収録刊行物
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- 日本冷凍空調学会論文集
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日本冷凍空調学会論文集 21 (4), 309-317, 2004
公益社団法人 日本冷凍空調学会
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詳細情報 詳細情報について
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- CRID
- 1390001204667284992
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- NII論文ID
- 130004566043
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- COI
- 1:CAS:528:DC%2BD2MXislKqt7o%3D
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- ISSN
- 2185789X
- 13444905
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可