Investigation of Cu wire stitch bonding. (Report 1). Influence of bonding condition and surface state on bondability.

DOI 1 Citations

Bibliographic Information

Other Title
  • 銅ワイヤステッチボンディングの接合性に関する研究　（第１報）　接合条件および表面性状と接合性の関係
  • Investigation on Cu wire stitch bonding (Report 1)
  • 銅ワイヤステッチボンディングの接合性に関する研究(第1報)

Abstract

Wire bonding is used as a method of the electrical connections between an electrode terminal on a chip of a semiconductor and an outer lead terminal. Cu wire has a good corrosion resistance and high electrical and thermal conductivity. Furthermore, Cu wire can be bonded directly to Cu alloy lead frame as a 2nd stitch bonding. For these reasons, a practical application of the Cu wire bonding process is anticipated. But, for application of Cu wire stitch bonding onto Cu alloy lead frame, there are a lot of difficult problems to be solved.<BR>In this report, the influence of the bonding conditions and surface states on the bondability of Cu wire stitch bonding is investigated. It is pointed out that the control of the wire deformation behavior is necessary for obtaining the good bondability in thermosonic Cu wire bonding. Furthermore, it is clarified that the surface state on Cu alloy lead affects on the bondability. If the maximum surface roughness on Cu alloy lead is more than 0.4 μm, or if the thickness of the oxide film on Cu alloy lead is more than 10 nm, the bondability of Cu wire stitch bonding is inferior.

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Details 詳細情報について

  • CRID
    1390001204722910464
  • NII Article ID
    130003764502
  • DOI
    10.2207/qjjws.14.168
  • COI
    1:CAS:528:DyaK28Xit1Kntbg%3D
  • ISSN
    24348252
    02884771
    http://id.crossref.org/issn/02884771
  • Text Lang
    ja
  • Data Source
    • JaLC
    • Crossref
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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