Cell placement of MCM for reliability optimization

DOI Web Site 被引用文献1件 参考文献7件
  • Kim Joonyun
    Electronics Department, Korea Aerospace Research Institute

書誌事項

公開日
2010
DOI
  • 10.1587/elex.7.1796
公開者
一般社団法人 電子情報通信学会

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説明

Since modern MCM (Multi Chip Module) is required to provide higher performance, MCM's density and power consumption has been increased very rapidly. Increase of chip density and power consumption lead to hot spots which accelerate the device's life time and result in device failure in the long run. In this paper, a new placement method is presented to improve the MCM's reliability using a TPSA (Two-Phase Simulated Annealing) algorithm. The TPSA searches the lowest failure rate placement of MCM perturbing higher failure rate phase and lower failure rate phase at the same time to generate a new movement. The proposed algorithm is applied to the IBM (International Business Machines) MCM device for searching an optimal solution and for comparing optimized results with other optimization results. The result shows improvement in reliability and temperature distribution satisfying constraints.

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