Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation
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- Ohba Takayuki
- ICE Cube Center, Tokyo Institute of Technology (Tokyo Tech)
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- Kim Youngsuk
- ICE Cube Center, Tokyo Institute of Technology (Tokyo Tech)
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- Mizushima Yoriko
- ICE Cube Center, Tokyo Institute of Technology (Tokyo Tech)
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- Maeda Nobuhide
- ICE Cube Center, Tokyo Institute of Technology (Tokyo Tech)
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- Fujimoto Koji
- ICE Cube Center, Tokyo Institute of Technology (Tokyo Tech)
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- Kodama Shoichi
- ICE Cube Center, Tokyo Institute of Technology (Tokyo Tech)
抄録
The prospects of three-dimensional (3D) integration for Terabyte large scale integration using bumpless interconnects with low-aspect-ratio TSVs and ultra-thinning are discussed. Bumpless (no bump) interconnects between wafers are a second-generation alternative to the use of micro-bumps for Wafer-on-Wafer (WOW) technology. Ultra-thinning of wafers down to 4 µm provides the advantage of a small form factor, not only in terms of the total volume of 3D ICs, but also the aspect ratio of Through-Silicon-Vias (TSVs). Our bumpless interconnects technology is classified into Via-Last, which is performed from the front side after thinning, and stacking Back-to-Front, in which any number of thinned 300 mm wafers and/or heterogeneous dies can be integrated. From an economic point of view, in many situations WOW is the leading 3D process because stacking at the wafer level drastically increases the processing throughput, and using multi-level bumpless interconnects, with individual wiring die-to-die, provides an appropriate yield that is equivalent to or greater than that achievable with 2D processes when scaling down to 22 nm nodes and beyond.
収録刊行物
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- IEICE Electronics Express
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IEICE Electronics Express 12 (7), 20152002-20152002, 2015
一般社団法人 電子情報通信学会
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詳細情報 詳細情報について
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- CRID
- 1390001205212776192
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- NII論文ID
- 130005063773
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- ISSN
- 13492543
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可