Effect of Evaluation Parameters for Pad Surface Asperity on Removal Rate in CMP

DOI

Bibliographic Information

Other Title
  • CMPの研磨レートに及ぼすパッド表面性状評価パラメータの影響分析

Abstract

Quantitative evaluation method of pad surface asperity is one of the most important technologies for the prediction of polishing characteristics. We have proposed a contact image analysis method using an image rotation prism, and we have demonstrated relationship between the pad surface asperity and polishing characteristics. However, these demonstrations were only the effect of each proposed four evaluation parameters on the removal rate. Hence, a proposition of an integrated index is necessary for prediction of high accurate polishing characteristics. This paper discusses the relationship between each evaluation parameters and the removal rate, and evaluates the effect of each evaluation parameters through the multiple correlation analysis method. It is clear that each evaluation parameters correlate closely with the removal rate. Moreover the result of multiple correlation analysis for each evaluation parameters can predict the removal rate precisely.

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Details 詳細情報について

  • CRID
    1390001205655852032
  • NII Article ID
    130005031902
  • DOI
    10.11522/pscjspe.2013s.0.619.0
  • Text Lang
    ja
  • Data Source
    • JaLC
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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