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- MIYASHITA Tadakazu
- Fujikoshi Machinery Corp.
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- SESHIMO Kiyoshi
- 九州大学 産学連携センター 連携部門
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- YAMAZAKI Tsutomu
- 九州大学 産学連携センター 連携部門
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- KAJIKURA Atsushi
- Fujikoshi Machinery Corp.
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- ICHIKAWA Daizo
- Fujikoshi Machinery Corp.
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- DOI Toshiro
- 九州大学 産学連携センター 連携部門
Bibliographic Information
- Other Title
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- 高速高圧研磨プロセス用研磨装置の開発
- -サファイヤならびに SiC 基板への適用とその加工特性-
- -Application and polishing characteristics of the Sapphire and SiC substrates -
Description
<p>Compound semiconductors used in power devices and optical devices such as LED .Among them materials ,SiC and GaN ,Sapphire are known as hard- to-processes materials .we have developed a high-speed and high-pressure polishing machine for aiming at high efficiency polishing of the hard-to-process materials .In this machine ,the rotation speed of table and work are 1000min-1 ,polishing pressure can be added up to 1000kPa ,it is designed to reduce vibration during high speed ,with a high rigidity .As a result of the evolution of the high-speed high-pressure polishing process ,it is possible to achieve a high efficiency .</p>
Journal
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- The Proceedings of Mechanical Engineering Congress, Japan
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The Proceedings of Mechanical Engineering Congress, Japan 2016 (0), S1630102-, 2016
The Japan Society of Mechanical Engineers
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Keywords
Details 詳細情報について
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- CRID
- 1390001205841109248
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- NII Article ID
- 130007069138
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- ISSN
- 24242667
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed