書誌事項
- タイトル別名
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- Development of the Polishing System for High-Speed & High-Pressure Polishing Process
- -サファイヤならびに SiC 基板への適用とその加工特性-
- -Application and polishing characteristics of the Sapphire and SiC substrates -
説明
<p>Compound semiconductors used in power devices and optical devices such as LED .Among them materials ,SiC and GaN ,Sapphire are known as hard- to-processes materials .we have developed a high-speed and high-pressure polishing machine for aiming at high efficiency polishing of the hard-to-process materials .In this machine ,the rotation speed of table and work are 1000min-1 ,polishing pressure can be added up to 1000kPa ,it is designed to reduce vibration during high speed ,with a high rigidity .As a result of the evolution of the high-speed high-pressure polishing process ,it is possible to achieve a high efficiency .</p>
収録刊行物
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- 年次大会
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年次大会 2016 (0), S1630102-, 2016
一般社団法人 日本機械学会
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詳細情報 詳細情報について
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- CRID
- 1390001205841109248
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- NII論文ID
- 130007069138
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- ISSN
- 24242667
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可