S1660101 Development of high-pressure/high-rotation processing machine and innovative polishing pad to achieve high efficiency and high-grade quality processing of wide-gap semiconductor material substrates
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- YAMAZAKI Tsutomu
- Kyushu Univ. KASTEC
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- SESHIMO Kiyoshi
- Kyushu Univ. KASTEC
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- OHTSUBO Masanori
- Kyushu Univ. KASTEC
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- MIYASHITA Tadakazu
- Fujikoshi Machinery Corp.
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- TAKAGI Masataka
- Fujibo Ehime Co., Ltd.
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- K.DOI Toshiro
- Kyushu Univ. KASTEC
Bibliographic Information
- Other Title
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- S1660101 ワイドギャップ半導体材料基板の高能率・高品位加工を実現する高速圧加工装置および革新的研磨パッドの開発([S166]窒化物半導体デバイスの精密加工プロセス)
Abstract
This study is intended to realize the high efficiency and high-grade quality processing of the wide gap semiconductor material substrate (SiC, GaN). We promote the research and development of the total process that fused each technique (device / system, polishing pad, slurry, etc.) into one ideally. By using a high-pressure / high-rotation processing machine and the innovative polishing pad which we developed in this study, it realized several-fold processing efficiency and large improvement of high-grade quality processing in comparison with a conventional technique.
Journal
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- The Proceedings of Mechanical Engineering Congress, Japan
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The Proceedings of Mechanical Engineering Congress, Japan 2014 (0), _S1660101--_S1660101-, 2014
The Japan Society of Mechanical Engineers
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Keywords
Details 詳細情報について
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- CRID
- 1390001205843808512
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- NII Article ID
- 110009945349
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- ISSN
- 24242667
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed