Mechanical reliability improvement by the internal resorption type laser dicing

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  • 内部吸収型レーザダイシングによる機械信頼性向上

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<p>Stealth Dicing (SD) is an innovative laser dicing technology for semiconductor Si wafer developed by Hamamatsu Photonics K. K. In the advanced dicing process, pulsed laser beam focused in transparent wafer generates local modification regions which can become origins of cracks for separation. Because of non-contact and internal process, the SD process has many advantages such as completely dry process, high speed, high quality, low kerf loss and low running costs.</p><p>In this study, comparison of mechanical strength of chips processed by SD with by blade dicing (BD) was carried out. The results of there-points bending tests indicated that deflecting strength of wafer processed by SD is about a half and one times greater than by BD. Additionally, the experimental results suggested that the SD process realizes more stable mechanical strength and higher production efficiency. Therefore, it is supposed that the SD process could be appropriate to dicing of thin wafers and MEMS devices.</p>

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