書誌事項
- タイトル別名
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- Effect of free-standing Al/Ni multilayer film on thermal resistance of reactively-bonded solder joints
抄録
<p>To reduce the thermal resistance of solder joints obtained by Al/Ni exothermic reaction, we have fabricated the bonded specimens using the free-standing Al/Ni multilayer film. It is found that the thermal resistance of free-standing AlNi specimen is much lower than that of conventional as-deposited AlNi specimen. It could be considered that free-standing Al/Ni films have an influence on decreasing the number of voids generated at the solder interface, leading to reduction in the resistance of solder joints.</p>
収録刊行物
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- 年次大会
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年次大会 2017 (0), J2210303-, 2017
一般社団法人 日本機械学会
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キーワード
詳細情報 詳細情報について
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- CRID
- 1390001205843940736
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- NII論文ID
- 130006550501
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- ISSN
- 24242667
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可