OS0111 Behavior of water flow on rotating wafer in cleaning process

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  • OS0111 半導体ウェーハの回転洗浄における流れの挙動

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Behavior of water flow on rotating wafer were experimentally investigated. Liquid film thickness were measured by using a laser displacement meter. Shear force at the wafer surface by liquid film flow was estimated from the liquid film thickness. Removable diameter of the fine particles was estimated from the shear force. It was confirmed that the minimum removable diameter of fine particle become large around the area of hydraulic jump.

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