書誌事項
- タイトル別名
-
- Effect of Base Materials on Mechanical Properties of Electroplated Copper Thin Films
抄録
<p>Physical properties of electroplated copper thin film used for interconnection materials of devices have a wide distribution in the manufacturing process. In this study, effects of the microtexture of a seed layer on mechanical properties and crystallinity of an electroplated copper thin film were investigated. It was found that quality of the atomic arrangement and crystallographic orientation of the electroplated thin film changed drastically depending on the microtexture of a seed layer. As a result, hardness and Young’s modulus of the electroplated thin film varied from about 1.1 to 2.6 GPa and 115 to 150 GPa, respectively.</p>
収録刊行物
-
- M&M材料力学カンファレンス
-
M&M材料力学カンファレンス 2016 (0), OS11-20-, 2016
一般社団法人 日本機械学会
- Tweet
詳細情報 詳細情報について
-
- CRID
- 1390001205871255424
-
- NII論文ID
- 130007119877
-
- ISSN
- 24242845
-
- 本文言語コード
- ja
-
- データソース種別
-
- JaLC
- Crossref
- CiNii Articles
-
- 抄録ライセンスフラグ
- 使用不可