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Inhibition of Whisker Growth from Zinc Electroplate
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- OHKAWARA Kaoru
- Fukushima Technology Centre
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- MUROI Ryoichi
- Sambix Co., Ltd.
Bibliographic Information
- Other Title
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- 亜鉛めっきのホイスカ抑止について
Description
Spontaneous growth of whiskers from electroplated zinc is known to occur at room temperature. Since whiskers may occasionally cause short-circuiting, prevention of the whisker growth is a technologically important problem in the electronics industry. Recently, a new problem that zinc whiskers from zinc plated props at raised access floor are transported into a computer through the cooling fan and cause shut down of the computer, is occurred. High concentrations of cyanide in zinc baths contribute to the role of the brightener and lead to declined internal stress levels in the plating, which significantly affects the inhibition of whisker growth.
Journal
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- Hyomen Kagaku
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Hyomen Kagaku 26 (3), 165-170, 2005
The Surface Science Society of Japan
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Details 詳細情報について
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- CRID
- 1390001206458393984
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- NII Article ID
- 130004486252
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- COI
- 1:CAS:528:DC%2BD2MXksFOgsLc%3D
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- ISSN
- 18814743
- 03885321
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- CiNii Articles
- OpenAIRE
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- Abstract License Flag
- Disallowed