書誌事項
- タイトル別名
-
- Precise Sound Velocity Measurement Using Laser Ultrasound and its Application for Temperature Measurement in Semiconductor Processing
- レーザー チョウオンパ ニ ヨル セイミツ オンソク ソクテイ ト ハンドウタイ プロセス ノ オンド ケイソク エノ オウヨウ
この論文をさがす
抄録
A non-contact and precise longitudinal velocity measurement technique, for temperature measurement in semiconductor processing, was developed using a combination of 100 MHz narrow-band laser ultrasound and a pulse-echo-overlap technique. A diffraction correction method for laser ultrasound, based on a Gaussian weighted circular source — a point detection model, was also developed to enhance the accuracy of echo period measurements. It was shown that the longitudinal velocity in 10mm thick single crystal silicon can be measured with a resolution of better than 0.01% . It was also shown that the temperature of a 0.6mm thick silicon wafer can be evaluated with a resolution higher than 2oC at 500oC and 1000oC.
収録刊行物
-
- 非破壊検査
-
非破壊検査 57 (4), 204-209, 2008
一般社団法人 日本非破壊検査協会
- Tweet
キーワード
詳細情報 詳細情報について
-
- CRID
- 1390001206493556480
-
- NII論文ID
- 130004458093
- 10021165132
-
- NII書誌ID
- AN00208370
-
- NDL書誌ID
- 9450043
-
- ISSN
- 03675866
-
- 本文言語コード
- ja
-
- データソース種別
-
- JaLC
- NDL
- CiNii Articles
-
- 抄録ライセンスフラグ
- 使用不可
