Electrodeposition of Ni-Cu Alloys in an Air and Water Stable Room Temperature Ionic Liquid
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- DENG Ming-Jay
- Department of Chemistry, National Cheng Kung University
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- LIN Pei-Chiung
- Department of Chemistry, National Cheng Kung University
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- SUN I-Wen
- Department of Chemistry, National Cheng Kung University
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- CHEN Po-Yu
- Faculty of Medicinal and Applied Chemistry, Kaohsiung Medical University
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- CHANG Jeng-Kuei
- Department of Materials Science and Engineering, National Cheng Kung University
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説明
Due to the ligand property of the DCA anion, both CuCl and NiCl2 are soluble in 1-ethyl-3-methylimidazolium dicyanamide (EMI-DCA) ionic liquid. Cyclic voltammograms of Ni(II), Cu(I), and Ni(II)+Cu(I), respectively, in EMI-DCA were recorded on the glassy carbon electrode at 30°C. It is interesting to note that the thermodynamic deposition potentials of Ni and Cu are very close to each other. This is especially favorable for the electrodeposition of Ni-Cu alloys without any additive. The Ni-Cu alloys were electrodeposited using bulk controlled-potential electrolysis experiments. Energy-dispersive spectroscopy (EDS) data indicates that the composition of the Ni-Cu alloys not only depends on the deposition potential, but also on the Cu(I) and Ni(II) concentrations in the melt.
収録刊行物
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- Electrochemistry
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Electrochemistry 77 (8), 582-584, 2009
公益社団法人 電気化学会
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詳細情報 詳細情報について
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- CRID
- 1390001206497559680
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- NII論文ID
- 10025015373
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- NII書誌ID
- AN00151637
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- COI
- 1:CAS:528:DC%2BD1MXhtVSiu7fF
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- ISSN
- 21862451
- 13443542
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- NDL書誌ID
- 10340520
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
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