Evaluation of Thermal Resistance for Underfill Layer in Three-dimensional Stacked ICs by Transient Thermal Analysis

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Other Title
  • 過渡熱解析による3次元積層IC内のアンダーフィル層の熱抵抗の評価
  • カト ネツ カイセキ ニ ヨル 3ジゲン セキソウ IC ナイ ノ アンダーフィルソウ ノ ネツ テイコウ ノ ヒョウカ

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Description

In this study, the relation between thermal conductivity of underfill and thermal resistance of micro bump layer in threedimensional stacked ICs was investigated. Thermal analysis model of stacked ICs with local heat source was created and thermal transient simulation was carried out. Thermal structure function of the model was calculated and thermal resistance of micro bump layer was evaluated. As a result, it was found that increase in thermal conductivity of underfill up to 6 W/m・K caused a rapid decrease in thermal resistance of micro bump layer. On the other hand, when thermal conductivity of underfill was larger than that value, thermal resistance of micro bump layer was almost stable.

Journal

  • Journal of Smart Processing

    Journal of Smart Processing 7 (4), 122-127, 2018

    Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan)

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