書誌事項
- タイトル別名
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- Effect of Ni Content in the Electroless Copper Plating Film on Recrystallization at the Bottom of via in Printed Circuit Board
- プリント ハイセンバン ニ オケル ビア テイブ ノ サイケッショウカ ニ オヨボス ムデンカイ ドウメッキ ヒマク チュウ ノ ニッケル ガンユウリツ ノ エイキョウ
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説明
Electroless copper plating is an important process to improve the electrical reliability at the bottom of the via. In this study, the effects of nickel ions added to the electroless copper plating bath on throwing power, electrical conductivity, and the recrystallization of electro copper plating films were investigated. When the electroless copper plating film to be the seed layer had high purity and low film thickness, the crystal grains of the inner layer copper and the electro copper plating showed continuity with the recrystallization at room temperature. The co-deposition of nickel in the electroless copper plating film increased the sheet resistance and hindered the continuity with the crystal grains of the inner layer copper. When continuity with the crystal grains of the inner layer copper occurred, the solder heat resistance test showed high electrical reliability.
収録刊行物
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- Journal of Smart Processing
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Journal of Smart Processing 9 (5), 210-215, 2020-09-10
一般社団法人 スマートプロセス学会 （旧高温学会）
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詳細情報 詳細情報について
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- CRID
- 1390004222620675712
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- NII論文ID
- 130007906007
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- NII書誌ID
- AA12553487
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- ISSN
- 21871337
- 2186702X
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- NDL書誌ID
- 030653343
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可
