高圧マイクロジェットを用いたCMPパッドコンディショニング技術

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  • コウアツ マイクロ ジェット オ モチイタ CMP パッド コンディショニング ギジュツ

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Conventional diamond disc pad conditioning methods employed in chemical mechanical planarization (CMP) have presented several problems for integrated circuit (IC) manufacturers. These include diamond wear, which reduces pad life, and diamond fracture, which causes the semiconductor devices to be scratched by loose diamond fragments. In order to attempt to overcome these problems, a high-pressure micro jet (HPMJ) conditioning system, in which pressurized ultra pure water (UPW) ranging from 3 - 20 MPa is sprayed on the pad surface, is proposed and developed. In this study, it is demonstrated that the HPMJ can adapt the pad conditioning of device CMP and silicon CMP for the experiments.

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