書誌事項
- タイトル別名
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- コウアツ マイクロ ジェット オ モチイタ CMP パッド コンディショニング ギジュツ
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説明
type:text
Conventional diamond disc pad conditioning methods employed in chemical mechanical planarization (CMP) have presented several problems for integrated circuit (IC) manufacturers. These include diamond wear, which reduces pad life, and diamond fracture, which causes the semiconductor devices to be scratched by loose diamond fragments. In order to attempt to overcome these problems, a high-pressure micro jet (HPMJ) conditioning system, in which pressurized ultra pure water (UPW) ranging from 3 - 20 MPa is sprayed on the pad surface, is proposed and developed. In this study, it is demonstrated that the HPMJ can adapt the pad conditioning of device CMP and silicon CMP for the experiments.
収録刊行物
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- 埼玉大学地域共同研究センター紀要 = Report of Cooperative Research Center, Saitama University
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埼玉大学地域共同研究センター紀要 = Report of Cooperative Research Center, Saitama University 7 14-19, 2007
埼玉大学総合研究機構地域共同研究センター産学連携推進部門
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詳細情報 詳細情報について
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- CRID
- 1390009224813818112
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- NII論文ID
- 120006388571
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- NII書誌ID
- AA11808968
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- NDL書誌ID
- 8924825
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- ISSN
- 13474758
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- IRDB
- NDL
- CiNii Articles