書誌事項
- タイトル別名
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- Substrate Wiring Formation by Imprinting Technology Using a Soft Replica
抄録
A master mold which defines the final wiring configuration is firstly fabricated, then transferred to a replica mold to form an inverted shape of the master mold, succeeded with the filling of recesses of the replica mold with conductive paste, and finally the conductive paste will be transferred to a substrate. We report on the development of a technology for forming wirings with a relatively simple process using imprinting technology. Thanks to a soft replica mold, wirings have been successfully transferred across the substrate wiring steps with 10-micron high. This imprinting technology keeps it possible to form fine and high aspect substrate wirings with low temperature process.
収録刊行物
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- Journal of Smart Processing
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Journal of Smart Processing 11 (5), 221-226, 2022-09-10
一般社団法人 スマートプロセス学会 （旧高温学会）
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詳細情報 詳細情報について
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- CRID
- 1390012158461067648
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- ISSN
- 21871337
- 2186702X
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
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- 抄録ライセンスフラグ
- 使用不可