Substrate Wiring Formation by Imprinting Technology Using a Soft Replica

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Other Title
  • ソフトレプリカを用いたインプリント技術による基板配線形成

Abstract

A master mold which defines the final wiring configuration is firstly fabricated, then transferred to a replica mold to form an inverted shape of the master mold, succeeded with the filling of recesses of the replica mold with conductive paste, and finally the conductive paste will be transferred to a substrate. We report on the development of a technology for forming wirings with a relatively simple process using imprinting technology. Thanks to a soft replica mold, wirings have been successfully transferred across the substrate wiring steps with 10-micron high. This imprinting technology keeps it possible to form fine and high aspect substrate wirings with low temperature process.

Journal

  • Journal of Smart Processing

    Journal of Smart Processing 11 (5), 221-226, 2022-09-10

    Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan)

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