Study on factors affecting wafer actions during double-sided lapping

DOI

Bibliographic Information

Other Title
  • 両面ラッピング加工中のウェーハ挙動に影響を与える因子に関する研究

Abstract

<p>Wafer actions cannot be observed in 4-way lapping because the carrier and wafer are sandwiched between the upper and lower plates. Therefore, the factors that affect the wafer actions during processing are unclear. In this study, the wafer actions were observed using an acrylic plate in place of the upper plate in a 4-way lapping machine. The results showed that the wafer rotated during lapping, but this rotation fluctuated considerably according to the position of the carrier. In addition, the lattice groove pitch of the plate or carrier material, etc., affected the wafer rotation. The effects of wafer rotation while held by the carrier on processing characteristics were then clarified experimentally.</p>

Journal

Keywords

Details 詳細情報について

  • CRID
    1390013795251495424
  • DOI
    10.11420/jsat.66.524
  • ISSN
    18807534
    09142703
  • Text Lang
    ja
  • Data Source
    • JaLC
  • Abstract License Flag
    Disallowed

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