Clarification of Polishing Mechanism Focusing on Polishing Pad in CMP

DOI

Bibliographic Information

Other Title
  • CMPにおける研磨パッドに着目した研磨機構の解明
  • Investigation of the effect of pad surface shape formed on the pore edge on polishing performance
  • ポア縁辺に形成されるパッド表面形状が研磨性能に与える影響の調査

Description

<p>As a clue to the clarification of the polishing principle of CMP, the surface topography of the polishing pad was observed using a confocal microscope. It was confirmed that pad surface protrusions, which are thought to contact wafers during polishing and contribute to polishing, are formed mainly at the upstream portion of the pore edge in the flow direction. In this paper, the relationship between the projection shapes formed on the pore edges and the pore depths is discussed.</p>

Journal

Keywords

Details 詳細情報について

Report a problem

Back to top