Low-Temperature Bonding Materials and Insulation Materials for High-Density 3D Packaging
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- Sakamoto Hirokatsu
- Daicel Corporation
Bibliographic Information
- Other Title
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- 高密度3次元実装を実現する低温接合材料と絶縁材料
Journal
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- Journal of The Japan Institute of Electronics Packaging
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Journal of The Japan Institute of Electronics Packaging 27 (5), 398-403, 2024-08-01
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390019534938323456
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- ISSN
- 1884121X
- 13439677
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref