Development of Resins for Bumpless Interconnects and Wafer-On-Wafer (WOW) Integration
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- Araki Naoko
- Daicel Corporation
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- Fukuda Tadashi
- Tokyo Institute of Technology, Institute of Innovative Research (IIR)
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- Ohba Takayuki
- Tokyo Institute of Technology, Institute of Innovative Research (IIR)
Bibliographic Information
- Other Title
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- バンプレス接合によるWafer-On-Wafer積層用樹脂の開発
Journal
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- Journal of The Japan Institute of Electronics Packaging
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Journal of The Japan Institute of Electronics Packaging 27 (5), 478-483, 2024-08-01
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390019534938329472
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- ISSN
- 1884121X
- 13439677
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref