A Study of Application of Dry-filmed Photoresist to Micro-lithography.

DOI

Bibliographic Information

Other Title
  • ドライフィルム型レジストを用いたマイクロリソグラフィーに関する検討

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Description

A dry-filmed photoresist material composed of three layers, a peel-off support, a water-soluble peeling layer, and a positive-type photoresist layer arranged in this order has been prepared. A process for the formation of a resist-pattern which comprised of laminating the photoresist layer on the substrate (e. g. silicon wafer) under heating and pressure, peeling off the peel-off support of the material, imagewisely exposing the photoresist layer and developing the material was discussed. In addition, the dry-filmed photoresist material was also able to form the resist-pattern on a substrate with an uneven surface without poor transfer due to bubbles and so on. The reasons of the formation of the resist-pattern on the substrate with an uneven surface were discussed on the basis of the analysis of material's thermal behaviors.

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Details 詳細情報について

  • CRID
    1390282679066445568
  • NII Article ID
    130004186758
  • DOI
    10.11413/nig1987.32.298
  • ISSN
    18824935
    09143319
  • Text Lang
    ja
  • Data Source
    • JaLC
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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