Wafer Level Three Dimensional Integration Technology
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- KURINO Hiroyuki
- Graduate School of Engineering, Tohoku University
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- KOYANAGI Mitsumasa
- Graduate School of Engineering, Tohoku University
Bibliographic Information
- Other Title
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- スーパーコネクト技術 ウェーハレベル３次元集積化技術
- カイセツ ウェーハ レベル 3ジゲン シュウセキカ ギジュツ
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Journal
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- Journal of The Surface Finishing Society of Japan
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Journal of The Surface Finishing Society of Japan 53 (4), 228-232, 2002
The Surface Finishing Society of Japan
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Details 詳細情報について
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- CRID
- 1390282679090313984
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- NII Article ID
- 10008222280
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- NII Book ID
- AN1005202X
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- COI
- 1:CAS:528:DC%2BD38XksVWnurY%3D
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- ISSN
- 18843409
- 09151869
- http://id.crossref.org/issn/09151869
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- NDL BIB ID
- 6143947
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL Search
- Crossref
- CiNii Articles
- OpenAIRE
