粗化処理無しの平滑銅-エポキシ絶縁樹脂間の密着性

書誌事項

タイトル別名
  • Adhesion between Flat Copper Surfaces and Epoxy Insulation Resin without Roughening.

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抄録

Adhesion strength between flat copper and epoxy resin was studied by forming sulfur codeposited copper films or sulfide films on the flat copper surface, with the following results:<br>1. Copper films from an electroless coper plating bath with sodium sulfide strongly adhered to epoxy resin. Adhesion strength was particularly improved by adding over 100ppm sodium sulfide tothe plating bath.<br>2. The formation of sulfide films on the copper surface using sodium sulfide solution also effectively improved adhesion. Triazine dithiole treatment also showed a similar effect.

収録刊行物

  • 表面技術

    表面技術 50 (1), 101-102, 1999

    一般社団法人 表面技術協会

被引用文献 (1)*注記

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参考文献 (3)*注記

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詳細情報 詳細情報について

  • CRID
    1390282679091389056
  • NII論文ID
    10002111703
  • NII書誌ID
    AN1005202X
  • DOI
    10.4139/sfj.50.101
  • ISSN
    18843409
    09151869
  • 本文言語コード
    en
  • データソース種別
    • JaLC
    • Crossref
    • CiNii Articles
  • 抄録ライセンスフラグ
    使用不可

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