書誌事項
- タイトル別名
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- Adhesion between Flat Copper Surfaces and Epoxy Insulation Resin without Roughening.
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抄録
Adhesion strength between flat copper and epoxy resin was studied by forming sulfur codeposited copper films or sulfide films on the flat copper surface, with the following results:<br>1. Copper films from an electroless coper plating bath with sodium sulfide strongly adhered to epoxy resin. Adhesion strength was particularly improved by adding over 100ppm sodium sulfide tothe plating bath.<br>2. The formation of sulfide films on the copper surface using sodium sulfide solution also effectively improved adhesion. Triazine dithiole treatment also showed a similar effect.
収録刊行物
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- 表面技術
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表面技術 50 (1), 101-102, 1999
一般社団法人 表面技術協会
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詳細情報 詳細情報について
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- CRID
- 1390282679091389056
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- NII論文ID
- 10002111703
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- NII書誌ID
- AN1005202X
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- ISSN
- 18843409
- 09151869
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可