Pretreatment for Void-Free Electroless Copper Plating.

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  • ボイドフリー無電解銅めっきの前処理について
  • ボイドフリー ムデンカイ ドウ メッキ ノ マエショリ ニ ツイテ

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Plating failures such as skip plating and miss plating in small through holes on a printed circuit board can be eliminated by modification of the acceleration solution.<br>These failures were greatly diminished without adhesion failure between the deposited copper and copper foil by the addition of a reducing agent such as hydrazine sulfate, hydroxylamine sulfate, DMAB or sodium hypophosphite into the sulfuric acid acceleration solution.<br>Anodic polarization curves showed that the activity of the palladium catalyst was increased by these reducing agents.<br>Conditioning treatment with a cation-based surface active agent enhanced the coverage of the palladium catalyst on the glass layer and lead to avoidance of these failures.<br>Control of the dissolved oxygen in the electroless copper solution was also effective in suppressing these phenomena.

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