- 【Updated on May 12, 2025】 Integration of CiNii Dissertations and CiNii Books into CiNii Research
- Trial version of CiNii Research Automatic Translation feature is available on CiNii Labs
- Suspension and deletion of data provided by Nikkei BP
- Regarding the recording of “Research Data” and “Evidence Data”
Wafer Level Process for Packaging
-
- WAKABAYASHI Takeshi
- HTL Co. Japan Ltd.
Bibliographic Information
- Other Title
-
- 半導体パッケージにおけるウエハレベルの加工
- ハンドウタイ パッケージ ニ オケル ウエハレベル ノ カコウ
Search this article
Journal
-
- Journal of The Surface Finishing Society of Japan
-
Journal of The Surface Finishing Society of Japan 67 (8), 409-413, 2016
The Surface Finishing Society of Japan
- Tweet
Details 詳細情報について
-
- CRID
- 1390282679092943360
-
- NII Article ID
- 130005875870
-
- NII Book ID
- AN1005202X
-
- ISSN
- 18843409
- 09151869
-
- NDL BIB ID
- 027599127
-
- Text Lang
- ja
-
- Data Source
-
- JaLC
- NDL Search
- Crossref
- CiNii Articles
