書誌事項
- タイトル別名
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- Electroless Deposition of Tin Using Contact with Zinc Powder in the Bath
- アエン ビリュウシ ノ セッショク オ リヨウ スル ムデンカイ スズメッキ
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Electroless deposition of tin film is an important process, particularly for joining in flexible printed circuit board (FPC) and chip-on-film (COF) tapes. Electroless deposition of tin from the tin (Ⅱ)-citrate bath was investigated using contact with zinc powder in the bath. Tin was deposited electrolessly onto a copper substrate by contact with zinc powder in the tin (Ⅱ)-citrate bath. The process, which is environmentally friendly, provides a high tin deposition rate of approximately 8 μmh−1. That rate is much higher than that of the autocatalytic deposition process using TiCl3 as a reducing agent. Furthermore, no copper substrate dissolution was observed. Results of local polarization curve measurements indicate that the mixed potential theory is applicable to this reaction.
収録刊行物
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- 表面技術
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表面技術 65 (9), 453-457, 2014
一般社団法人 表面技術協会
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詳細情報 詳細情報について
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- CRID
- 1390282679094585600
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- NII論文ID
- 130005096761
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- NII書誌ID
- AN1005202X
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- ISSN
- 18843409
- 09151869
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- NDL書誌ID
- 025794650
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可