Electrodeposition and Properties of Gold-Nickel Alloy Film with a Nanocrystalline-Amorphous Mixed Structure

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  • SENDA Kazutaka
    Central Research Laboratory, Kanto Chemical Co., Inc.
  • IWAI Ryota
    Central Research Laboratory, Kanto Chemical Co., Inc.
  • TOKUHISA Tomoaki
    Central Research Laboratory, Kanto Chemical Co., Inc.
  • KATO Masaru
    Central Research Laboratory, Kanto Chemical Co., Inc.
  • YAMACHIKA Noriyuki
    School of Advanced Science and Engineering, Waseda University
  • OKINAKA Yutaka
    Research Institute for Science and Engineering, Waseda University
  • OSAKA Tetsuya
    School of Advanced Science and Engineering, Waseda University Research Institute for Science and Engineering, Waseda University Faculty of Science and Engineering, Waseda University

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  • 微細結晶－非晶質混在金・ニッケル合金めっき膜の析出条件と物性
  • ビサイ ケッショウ ヒショウシツ コンザイキン ニッケル ゴウキンメッキ マク ノ セキシュツ ジョウケン ト ブッセイ

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As an electrical contact material that is compatible with the recent trend of miniaturization of electronic devices and components, the authors have been investigating electrodeposited amorphous gold alloys with properties that are unaffected by their crystal-grain size, unlike conventional electroplated hard gold. Amorphous alloys in general, however, are known to suffer from high electrical resistivity because of the short mean free path of electrons in such alloys. To resolve this problem, we developed a process of electroplating Au-Ni alloy films with a mixture of nanocrystalline and amorphous phases and investigated the films' physical characteristics. Results show that those Au-Ni films with mixed phases possess low electrical resistivity, retaining corrosion resistance in a range of practical tolerances. The microstructure of the new material of nanocrystalline-amorphous Au-Ni alloy excels in mechanical strength while retaining the properties of Au. Moreover, it is thermally stable at temperatures up to 300°C. Consequently, this new material is expected to be useful as a material for electrical contact surfaces. Furthermore, this study revealed that the electroplated Au-Ni alloy film microstructure is controllable by selecting suitable bath compositions and plating conditions.

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