Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

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  • Shin Young-Eui
    Department of Mechanical Engineering, Chung-Ang University
  • Lee Kyung-Woo
    Department of Mechanical Engineering, Chung-Ang University
  • Chang Kyong-Ho
    Department of Civil and Environmental Engineering, Chung-Ang University
  • Jung Seung-Boo
    Department of Metallurgical Engineering, Sung Kyun Kwan University
  • Jung Jae Pil
    Department of Material Science & Engineering, The University of Seoul

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説明

This study was focused on the numerical prediction of the thermal fatigue life of a μBGA (Micro Ball Grid Array) solder joint. Numerical method was performed to predict three-dimensional finite element analysis with various solder alloys such as Sn–37 mass%Pb, Sn–3.5 mass%Ag, Sn–3.5 mass%Ag–0.7 mass%Cu and Sn–3.5 mass%Ag–3 mass%In–0.5 mass%Bi during a given thermal cycling. Strain values, which were obtained by the result of mechanical fatigue tests for solder alloys, were used to predict the solder joint fatigue life using the Coffin-Manson equation. The numerical results showed that Sn–3.5 mass%Ag with the 50 degree ball shape geometry had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable γ.

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