Effects of Phosphorus on Microstructure and Fluidity of Sn-0.7Cu-0.05Ni Lead-Free Solder
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- Nogita K.
- Materials Engineering, The University of Queensland
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- Gourlay C. M.
- Materials Engineering, The University of Queensland
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- Read J.
- Materials Engineering, The University of Queensland
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- Nishimura T.
- Nihon Superior Co., Ltd, NS Bldg.
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- Suenaga S.
- Nihon Superior Co., Ltd, NS Bldg.
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- Dahle A. K.
- Materials Engineering, The University of Queensland
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Abstract
Phosphorus is often added to wave-solder baths as an anti-oxidation agent. Despite this practice, there is little information on how phosphorus influences the solidification and flow properties of new lead-free solders such as Sn-0.7Cu-0.05Ni. This paper investigates the effects of phosphorus content on microstructure and maximum fluidity length in Sn-0.7Cu-0.05Ni-xP alloys containing 0–0.08 mass% phosphorous. Ppm levels of phosphorous are found to cause Sn-xP, Ni-xP-(Sn) and Cu-xP-(Sn) intermetallic compounds to form in the liquid solder. The IMCs are less dense than liquid Sn and float towards the surface of the melt driven by buoyancy. It is shown that P-free Sn-0.7Cu-0.05Ni solidifies with a near-eutectic microstructure whereas, when P is added to this alloy, a significant volume fraction of primary Sn dendrites form once the P content exceeds ∼0.01 mass% P. It is further shown that P additions decrease the ability of Sn-0.7Cu-0.05Ni to flow as it solidifies.
Journal
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- MATERIALS TRANSACTIONS
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MATERIALS TRANSACTIONS 49 (3), 443-448, 2008
The Japan Institute of Metals and Materials
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Details 詳細情報について
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- CRID
- 1390282679226576896
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- NII Article ID
- 10021144605
- 130004453910
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- NII Book ID
- AA1151294X
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- ISSN
- 13475320
- 13459678
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- NDL BIB ID
- 9412882
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- Text Lang
- en
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed