Mechanism of Low Temperature Sintering-Bonding through <i>In-Situ</i> Formation of Silver Nanoparticles Using Silver Oxide Microparticles

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  • Mu Fengwen
    Department of Mechanical Engineering, Tsinghua University Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
  • Zhao Zhenyu
    Department of Mechanical Engineering, Tsinghua University Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
  • Zou Guisheng
    Department of Mechanical Engineering, Tsinghua University Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
  • Bai Hailin
    Department of Mechanical Engineering, Tsinghua University Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
  • Wu Aiping
    Department of Mechanical Engineering, Tsinghua University Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
  • Liu Lei
    Department of Mechanical Engineering, Tsinghua University Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
  • Zhang Dongyue
    Department of Mechanical Engineering, Tsinghua University Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
  • Norman Zhou Y.
    Department of Mechanical Engineering, Tsinghua University Key Laboratory for Advanced Materials Processing Technology, Ministry of Education Department of Mechanical and Mechatronics Engineering, University of Waterloo

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  • Mechanism of Low Temperature Sintering-Bonding through In-Situ Formation of Silver Nanoparticles Using Silver Oxide Microparticles

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Abstract

In this paper, a low temperature sintering-bonding process through in-situ formation of silver (Ag) nanoparticles using silver–oxide (Ag2O) microparticles was studied. The Ag2O powders were mixed with triethylene glycol (TEG) to form a paste, which was used to bond the Ag-coated copper (Cu) bulks. The results revealed that high temperature was helpful to increase the bond strength, and the joints average shear strength can reach 21.9 MPa at 523 K under 2 MPa for 5 min. And the mechanism of the reaction and sintering bonding process were basically made clear by using TGA-FTIR, FE-SEM and XRD, further, a reasonable sintering-bonding model was proposed.

Journal

  • MATERIALS TRANSACTIONS

    MATERIALS TRANSACTIONS 54 (6), 872-878, 2013

    The Japan Institute of Metals and Materials

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