Mechanism of Low Temperature Sintering-Bonding through In-Situ Formation of Silver Nanoparticles Using Silver Oxide Microparticles
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- Mu Fengwen
- Department of Mechanical Engineering, Tsinghua University Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
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- Zhao Zhenyu
- Department of Mechanical Engineering, Tsinghua University Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
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- Zou Guisheng
- Department of Mechanical Engineering, Tsinghua University Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
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- Bai Hailin
- Department of Mechanical Engineering, Tsinghua University Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
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- Wu Aiping
- Department of Mechanical Engineering, Tsinghua University Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
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- Liu Lei
- Department of Mechanical Engineering, Tsinghua University Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
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- Zhang Dongyue
- Department of Mechanical Engineering, Tsinghua University Key Laboratory for Advanced Materials Processing Technology, Ministry of Education
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- Norman Zhou Y.
- Department of Mechanical Engineering, Tsinghua University Key Laboratory for Advanced Materials Processing Technology, Ministry of Education Department of Mechanical and Mechatronics Engineering, University of Waterloo
書誌事項
- タイトル別名
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- Mechanism of Low Temperature Sintering-Bonding through <i>In-Situ</i> Formation of Silver Nanoparticles Using Silver Oxide Microparticles
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抄録
In this paper, a low temperature sintering-bonding process through in-situ formation of silver (Ag) nanoparticles using silver–oxide (Ag2O) microparticles was studied. The Ag2O powders were mixed with triethylene glycol (TEG) to form a paste, which was used to bond the Ag-coated copper (Cu) bulks. The results revealed that high temperature was helpful to increase the bond strength, and the joints average shear strength can reach 21.9 MPa at 523 K under 2 MPa for 5 min. And the mechanism of the reaction and sintering bonding process were basically made clear by using TGA-FTIR, FE-SEM and XRD, further, a reasonable sintering-bonding model was proposed.
収録刊行物
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- MATERIALS TRANSACTIONS
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MATERIALS TRANSACTIONS 54 (6), 872-878, 2013
公益社団法人 日本金属学会
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詳細情報 詳細情報について
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- CRID
- 1390282679228734720
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- NII論文ID
- 10031176400
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- NII書誌ID
- AA1151294X
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- COI
- 1:CAS:528:DC%2BC3sXht1Wgu7zO
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- ISSN
- 13475320
- 13459678
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- NDL書誌ID
- 024524581
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
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- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可