Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part II. Flip-Chip Bonding on Compliant Substrates
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- Park Donghyun
- Department of Materials Science and Engineering, Hongik University
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- Han Kee-Sun
- Department of Materials Science and Engineering, Hongik University
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- Oh Tae Sung
- Department of Materials Science and Engineering, Hongik University
Bibliographic Information
- Other Title
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- Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates(Part 2)Flip-Chip Bonding on Compliant Substrates
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Abstract
<p>The contact resistance and microstructure of the flip-chip joints processed using anisotropic conductive adhesive (ACA) were characterized on flexible printed-circuit-board (FPCB) and stretchable FPCB/polydimethylsiloxane (FPCB/PDMS) substrates. On the FPCB substrate, the contact resistance was remarkably reduced from 56.9 mΩ to 13.3 mΩ when the bonding pressure increased from 10 MPa to 200 MPa. However, at a bonding pressure of 300 MPa, it substantially increased to 74.8 mΩ with an excessive deviation of ±37.7 mΩ. On the more compliant FPCB/PDMS substrate, the contact resistance decreased from 43.2 mΩ to 31.2 mΩ when the bonding pressure increased from 10 MPa to 50 MPa. Severe distortion of the FPCB/PDMS substrate occurred at bonding pressures above 50 MPa because of the softness of the PDMS. A more compliant substrate has a lower appropriate bonding pressure for the flip-chip process.</p>
Journal
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- MATERIALS TRANSACTIONS
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MATERIALS TRANSACTIONS 58 (8), 1217-1222, 2017
The Japan Institute of Metals and Materials
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Details 詳細情報について
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- CRID
- 1390282679229596544
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- NII Article ID
- 130005858746
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- NII Book ID
- AA1151294X
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- ISSN
- 13475320
- 13459678
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- NDL BIB ID
- 028386025
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- Text Lang
- en
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed